k4b2g0446b-k4b2go846b-k4b2g1646b-2gb-b-die-ddr3-sdram-7896-fbga-with-lead-free-halogen-free-rohs-compliant-datasheet.pdf

Overview

This datasheet describes the 2Gb DDR3 SDRAM B-die device, which is organized as a 64Mbit x 4 I/Os x 8 banks, 32Mbit x 8 I/Os x 8 banks, or 8Mbit x 16 I/Os x 8 banks device.

Key Features

The device achieves high-speed double-data-rate transfer rates of up to 1600Mb/sec/pin (DDR3-1600) and complies with JEDEC standard 1.5V ± 0.075V power supply.

It features posted CAS, programmable CWL, internal (self) calibration, programmable CAS latency, on-die termination using ODT pin, and asynchronous reset.

Package

The device is available in 78-ball FBGA (x4/x8) and 96-ball FBGA (x16) packages, which are lead-free and halogen-free, complying with RoHS standards.

Manual:

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Pricing & Distributors: https://www.datasheets360.com/part/detail/k4b2g0846b-hch90/-8386088560404042906/

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