rf-wirewound-chip-inductors.pdf

Overview

These high frequency, high-Q chip inductors feature a monolithic body made of low loss ceramic wound with wire to achieve optimal high frequency performance.

Key Features

Compact size, tape and reel packaging, ideal for high volume RF applications.

Nickel barrier with gold or 100% tin plating, depending on the core type.

Available in various EIA sizes (0402, 0603, 0805) with a range of inductance values and tolerances.

Applications

CELLPCS Modules, Broadband Components, RF Transceivers, Cable Modem, Bluetooth, Wireless LAN, RFID, Cordless Phone, Computer Peripherals, and ASDL.

Manual:

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Pricing & Distributors: https://www.datasheets360.com/part/detail/l-14w12njv4e/3080324563860604162/

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