rf-ceramic-chip-inductors.pdf

This datasheet describes a series of high frequency multi-layer chip inductors featuring a monolithic body made of low loss ceramic and high conductivity metal electrodes.

Key Features:

Compact size, lead-free tin plated nickel barrier terminations, and tape and reel packaging, making them ideal for small size, high volume wireless applications.

Applications:

CELL/PCS modules, wireless LAN, broadband components, RFID, and RF transceivers.

The inductors are available in various sizes (0201, 0402, 0603) with a wide range of inductance values and tolerances.

Manual:

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Pricing & Distributors: https://www.datasheets360.com/part/detail/l-07c1n9sv6t/4661175911614654138/

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