High Frequency Multi-Layer Chip Inductors
These RF chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes, achieving optimal high frequency performance.
They are compact in size and feature lead-free tin plated nickel barrier terminations and tape and reel packaging, making them ideal for small size, high volume wireless applications.
Applications and Features
Applications: CELL/PCS Modules, Wireless LAN, Broadband Components, RFID, and RF Transceivers.
Features: RoHS Compliant, Polarity Half-Marked Inductors (0201 only), and optional Sn/Pb Terminations.
Manual:
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Pricing & Distributors: https://www.datasheets360.com/part/detail/l-07c1n5st6s/6086976459896786197/
