rf-ceramic-chip-inductors.pdf

Overview

These high-frequency multi-layer chip inductors feature a monolithic ceramic body and high conductivity metal electrodes, offering optimal high-frequency performance in a compact size.

Key Features

Lead-free tin plated nickel barrier terminations, tape and reel packaging, and RoHS compliance make them ideal for small size, high volume wireless applications.

Applications

Cellular PCS modules, wireless LAN, broadband components, RFID, and RF transceivers.

Product Range

Available in various EIA sizes (01005, 0201, 0402, 0603, 0805) with inductance ranges from 0.6 nH to 680 nH and Q factors up to 135.

Manual:

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Pricing & Distributors: https://www.datasheets360.com/part/detail/l-15c39njv4e/7281246917146045459/

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