MMBFJ177 P-Channel Switch Datasheet

Category: Electronics, Fairchild Semiconductor, Transistors

The datasheet provided pertains to a series of P-Channel switches, specifically models J174, J175, J176, J177, MMBFJ175, MMBFJ176, and MMBFJ177. These devices are manufactured by Fairchild Semiconductor and are available in TO-92 and SOT-23 packages, with SOT-23 versions having the markings 6W, 6X, and 6Y. An important note from the datasheet states that the source and drain of these components are interchangeable.

Applications

The datasheet indicates the P-Channel switches are primarily designed for use in low-level analog switching, sample and hold circuits, and chopper-stabilized amplifiers. The technology for these devices is sourced from Process 88, although the datasheet does not provide further detail on this process within the first two pages.

Absolute Maximum Ratings

Absolute Maximum Ratings are provided to indicate the limits beyond which the device’s serviceability may be impaired. These ratings are specified at a standard temperature of 25°C unless otherwise noted. For the J174 – J177 and MMBFJ175 – MMBFJ177 devices, the datasheet specifies a Drain-Gate Voltage (VDG) and a Gate-Source Voltage (VGSS) of 30V, and a Forward Gate Current (IGF) of 50 mA. The operating and storage junction temperature range is noted from -55°C to +150°C. These ratings are based on a maximum junction temperature of 150°C. Additionally, while these are steady state limits, the factory should be consulted for applications that involve pulsed or low duty cycle operations.

Thermal Characteristics

The thermal characteristics define the maximum thermal limits of the devices which include the total device dissipation and the thermal resistance from both the junction to case and the junction to ambient. For the J174 – J177 range, the total device dissipation (PD) is listed as 350 mW, while the MMBFJ175 – MMBFJ177 range has a dissipation of 225 mW. Above the baseline temperature of 25°C, these devices have a derating of 2.8 mW/°C for the J-series and 1.8 mW/°C for the MMBFJ-series. The thermal resistance from the junction to case (RθJC) is specified as 125 °C/W, and junction to ambient (RθJA) is 357 °C/W for the J-series and 556 °C/W for the MMBFJ-series. The mentioned values are based on the devices being mounted on an FR-4 printed circuit board (PCB) measuring 1.6″ x 1.6″ x 0.06″.

The document was released in 1997 by Fairchild Semiconductor Corporation, which suggests that the information contained within the datasheet reflects the standards and technology of that time.