Overview
The provided content describes an Inverted Modular Jack Assembly with integrated Light Emitting Diodes (LEDs) for connectivity and indication purposes. This datasheet outlines the assembly’s specifications, materials, plating details, and suggests panel dimensions and positioning for the modular jack setup.
Revision History
Changes to the datasheet have been made as per various Engineering Change Orders (ECOs), with the latest revision by ECO-09_021826 and ECR 006801 on 12 September 2009. Further updates include changes approved on 01 April 2010. Obsolete parts and process compatibility notes are also mentioned in relation to discontinuations for streamline manufacturing.
Material and Plating
The housing is composed of a high-temperature thermoplastic, which is black in color and rated UL94V-0 for fire safety. The terminals are crafted from Phosphor Bronze material with a bright tin plating for soldering areas and a minimum gold plating for localized contact areas. Shielding is achieved using a copper-zinc alloy preplated with satin nickel and a post-dipped tin layer for the PCB ground tabs. LEDs feature diffused epoxy lenses and carbon steel wireframe leads with elaborate plating, including tin/copper, silver, and nickel-copper layers for durability and connectivity.
Device Construction and Compliance
Within the jack assembly, there are two wiring cavities which comply with FCC Rules and Regulations Part 68, Subpart F, for telecommunications. The datasheet suggests panel opening dimensions and advises on the clearance required between the top of the connector and the panel opening. The modular jack includes an integrated LED, which is not compatible with the IR reflow soldering process.
LED Specification and Color Identification
Several bi-color LED current diagrams are provided, differing based on part numbers ending with “406552” or “5406552_9”. The jack assembly encompasses LEDs with specified colors, and part numbers signify these colors, including combinations of green, red, yellow, green/orange, etc.
Manufacturing Date Code
The datasheet explains the location and interpretation of the manufacturing date code, detailing how to ascertain the year, workweek, and day of the week from the code provided.
Drawing and Layout Instructions
Additional information includes recommended printed circuit board layouts and multiple assembly dimensions given in both millimeters and inches. Instructions on recommended PCB layouts (component side) and detailed dimensions tailoring to product installation are also included, offering guidance for the product’s application.
Controlled Document Disclaimer
This datasheet is considered a controlled document, indicating that specifications should only be applied as per documented changes and official revisions without any alterations. It includes all necessary details to guide users in implementing the Inverted Modular Jack Assembly in their products effectively and safely.
Manual:
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