Overview of IBM PowerPC 750FX RISC Microprocessor
The IBM PowerPC 750FX RISC Microprocessor datasheet provides technical specifications and information pertaining to the PowerPC 750FX microprocessor, with emphasis on the design revision level DD 2X. Released preliminarily on June 9, 2003, this datasheet, version 2.0, serves as a guideline for developers and engineers who are utilizing this microprocessor in their designs. It contains essential information on product features, intended operation, and warnings regarding the processor’s use in safety-critical applications.
Trademark Acknowledgements
IBM and PowerPC related trademarks are acknowledged within the document, which are registered by International Business Machines Corporation in the United States and potentially other countries. These trademarks include the IBM logo, PowerPC logo, PowerPC 750, PowerPC Architecture, and RISCWatch. Additionally, the datasheet references third-party trademarks that belong to their respective owners.
Usage and Warranty Information
Important usage guidelines detailed within the document highlight that the PowerPC 750FX microprocessor is not to be used in implantation, life support systems, or other hazardous environments where failure could result in severe harm or damage. IBM clarifies that such usage scenarios are beyond the specifications and warranties of the product. Any usage of the information provided is at the risk of the user, and IBM holds no liability for damages or inaccuracies present. It is noted that the information contained in this document is preliminary and subject to change.
Environmental and Accuracy Disclaimer
Data in the document is derived from specific testing environments and serves as an illustrative example rather than a universally applicable set of data. Environments that differ from those tested may yield variable results; thus, the accuracy and completeness of the information are not guaranteed.
Contact and Further Information
For further information and verification of the latest document version, readers are advised to contact an IBM field applications engineer. Additionally, IBM’s corporate and microelectronics division home pages are provided for additional resources and contact information.
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