The datasheet provides information on high-frequency multi-layer chip inductors made of low-loss ceramic and high-conductivity metal electrodes. These inductors are designed for small-size/high-volume wireless applications and feature lead-free tin-plated nickel barrier terminations and tape and reel packaging.
The inductors are available in different sizes (0201, 0402, 0603, and 0805) and have a range of inductance values (1.0 nH to 39.0 nH). They exhibit optimal high-frequency performance, with quality factor (Q) values ranging from 4 to 12, depending on the size and inductance value.
The inductors have a typical self-resonant frequency (SRF) ranging from 65 GHz to 221 GHz, depending on the size and inductance value. They have a maximum rated current of 300 mA, with some sizes having a higher current rating.
The inductors are designed to be solderable and have a rating of 75% for solder coverage. They also withstand thermal shock, resistance to soldering, and humidity resistance tests.
Mechanical and environmental specifications include lateral pull force, terminal adhesion, and PCB deflection. The inductors are suitable for use in wireless applications such as wireless LAN, RFID, and custom applications.
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