dram-die-bga-isied-nt.pdf

This datasheet describes a DRAM (Dynamic Random Access Memory) component in a BGA (Ball Grid Array) package.

Physical Characteristics

The component has a specific layout and dimensions, with a scale of 6:1 and various measurements provided.

Materials

The contacts are made of nickel (Ni) and the plastic material is a high-temperature thermoplastic (Thermoplastic JL-9 4V0).

The component also has a bronze (Cu-Sn) material for the contacts.

Marking and Labeling

The component has specific markings, including a part number, date code, and other identifying information.

Manual:

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Pricing & Distributors: https://www.datasheets360.com/part/detail/0-281739-5/3473409551906414693/

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