The AMPMODU Interconnection System is a family of headers designed for card extender applications with pin protection and guide pins.
The headers feature a right-angle post design with double-row construction and a .100 x .100 [2.54 x 2.54] centerline spacing.
Key Features:
The headers have a glass-filled thermoplastic housing with phosphor bronze posts, available with two plating options: duplex plated gold on contact area and matte tin on termination end, or duplex plated gold on contact area and matte tin on termination end with an underplate of nickel.
The headers also feature board retention tails and localized gold plating on contact area.
Related Documents:
Refer to pages 95, 196 for mateable receptacles, page 194 for performance specifications, and page 276 for technical documents.
Manual:
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Pricing & Distributors: https://www.datasheets360.com/part/detail/5-102802-6/-4508955827614209167/