The AMPMODU interconnection system is a range of headers designed for card extender applications. These headers feature right-angle posts, double-row design, and a centerline of .100 x .100 [2.54 x 2.54]. They are available with pin protection and guide pins for added security and ease of use.
Key Features
The headers are made from glass-filled thermoplastic with phosphor bronze posts, plated with either duplex gold on the contact area and matte tin on the termination end (Plating A), or duplex gold on the contact area and matte tin on the termination end with an underplate of nickel (Plating B).
Board Retention Tails
Some headers feature board retention tails, which are available in various lengths. The recommended PC board hole layout is also provided for .055 [1.40] min. thick PC boards.
Manual:
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Pricing & Distributors: https://www.datasheets360.com/part/detail/5-102589-1/9174603206331714116/