Overview
The AMP MODU Interconnection System is a range of double-row receptacle assemblies with 100 x 100 [2.54 x 2.54] centerlines, closed entry, and short point-of-contact, featuring standoffs.
Key Features
Available in various sizes, with options for plating (A, B, or C) and compatible with different PC board hole layouts.
Related product data includes mateable headers, performance characteristics, and recommended PC board hole layouts.
Technical documents, product specifications, and application specifications are also available.
Notes and Recommendations
Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle assemblies, and suggests a minimum positive pin slop to prevent shorting between rows.
Manual:
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Pricing & Distributors: https://www.datasheets360.com/part/detail/5-102084-9/14180155159065749/
