74F827 10-bit Buffer/Line Driver Non-Inverting 3-State Datasheet

Category: Electronics, Logic ICS, NXP

Overview

The 74F827 is a high-performance 10-bit buffer/line driver with non-inverting outputs and three-state (3-state) functionality, optimized to provide bus interface buffering for wide data/address paths or buses that also carry parity. It is designed for applications that require both minimal bus loading and increased input fan-in, along with controlled signal rise and fall times to reduce noise, such as ground bounce.

Features

The 74F827 offers several key features beneficial for high-speed digital applications:

High Impedance NPN Base Inputs: This property helps in reducing the load on the bus, with an input current of just 20 µA for both HIGH and LOW logic levels, which is significantly lower than the input current of the FAST family specification (600 µA).
Controlled Signal Dynamics: The device is engineered to have controlled rise and fall times to minimize disruptive grounding effects like ground bounce.
Glitch-Free 3-State Operation: The 3-state functionality ensures a glitch-free power-up, maintaining signal integrity at all times when changing states.
The Flow-Through Pinout Architecture is suitable for streamlined connection with microprocessor-based systems, facilitating easier layout and routing on PCBs.
Capable of providing an output sink current (I_OL) of up to 64 mA, which is suitable for driving multiple loads.

Ordering Information

The datasheet provides details for ordering the 74F827 integrated circuit. It is available in different package types suitable for standard or reduced space applications and operates reliably over a temperature range from 0°C to 70°C. The available package types are:

SO24: Plastic Small Outline Package with 24 leads and a body width of 7.5 mm, identified as SOT137-1.
SSOP24: Plastic Shrink Small Outline Package with 24 leads and a body width of 5.3 mm, known as SOT340-1.

Functional Diagrams

The functional diagrams include logic symbols and a logic diagram that visually outlines the operational connections of the 74F827. These diagrams serve as a reference for understanding the chip’s internal structure and are useful for designing interfaces with other components of an electronic system. The logic symbols comply with IEC standards, ensuring clarity in representation.