rf-wirewound-chip-inductors.pdf

Overview

These high-frequency, high-Q chip inductors feature a monolithic body made of low-loss ceramic wound with wire to achieve optimal high-frequency performance.

Key Features

Compact size, tape and reel packaging, ideal for high-volume RF applications.

Nickel barrier with gold or 100% tin plating, depending on core type.

Available in various EIA sizes (0402, 0603, 0805) with a range of inductance values.

Applications

CELLPCS modules, broadband components, RF transceivers, cable modems, Bluetooth, wireless LAN, RFID, cordless phones, and computer peripherals.

Manual:

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Pricing & Distributors: https://www.datasheets360.com/part/detail/l-14w39njv4e/-4105451847364311421/

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