Overview
This datasheet describes a series of flip chip arrays designed for ESD protection in various applications, including cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART cards, and PCMCIA cards.
Key Features
The devices offer ESD protection up to 25 kilovolts, are available in voltages ranging from 3.3V to 36V, and have a peak pulse power of 250 watts per line. They feature a bidirectional configuration, monolithic structure, and are RoHS compliant.
Electrical Characteristics
The devices have a maximum peak pulse power of 250 watts, operating temperatures from -55°C to 150°C, and storage temperatures from -55°C to 150°C. The electrical characteristics per line include stand-off voltage, breakdown voltage, clamping voltage, and leakage current.
Manual:
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