Overview of Accu-L SMD High-Q RF Inductor
The Accu-L SMD High-Q RF Inductor, utilizing thin-film multilayer technology, is designed to meet the rigorous standards and challenges of the telecommunications industry. Its miniature size and high-frequency performance cater to the trend towards miniaturization and the rising demand for higher frequencies in modern communication technologies.
Key Technologies and Benefits
With a foundation in thin-film multilayer technology, the Accu-L SMD Inductor assures precise control over electrical and physical components, resulting in consistent performance both within and across production lots. Benefits such as a compact form factor, robust construction, and high-Q RF power handling make it optimal for reliable automatic assembly. Superior solderability and low parasitic effects coupled with better heat dissipation ensure enhanced performance in a variety of applications.
Applications
The Accu-L SMD High-Q RF Inductor is notably suitable for mobile communications, with frequencies spanning from traditional cellular bands (450MHz, 900MHz) to future bands (1700MHz, 1900MHz, 2400MHz). Its versatility also extends to satellite TV receivers, GPS vehicle location systems, wireless LANs, and radio-frequency circuits such as filters and matching networks.
Product Features
Distinctive features of the Accu-L inductor include high Q-factor, high Self-Resonant Frequency (SRF), low DC resistance, ultra-tight tolerance on inductance, and low-profile, rugged design. Available standard chip sizes include the 0603 and 0805, with options for taping and reeling for streamlined handling and installation.
Ordering Information and Quality Inspections
Customization and precise specifications can be achieved during ordering by selecting from a variety of sizes, inductance values, tolerances, specification codes, and termination options including lead-free alternatives. Finished parts are subjected to exhaustive testing for all electrical parameters and visual characteristics. Furthermore, every production batch is sampled and tested for static humidity and endurance to ensure reliability under harsh conditions.
Termination and Pad Layout Recommendations
The indluctor features nickel/solder coating for compatibility with numerous automatic soldering technologies such as reflow, wave soldering, vapor phase, and manual techniques. The datasheet also provides recommendations for pad layout dimensions to facilitate optimal mounting on printed circuit boards.
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