The datasheet outlines the key features of Microsemi’s ProASIC3 Flash Family Field-Programmable Gate Arrays (FPGAs), which are engineered to accommodate the requirements of automotive applications. The FPGAs are categorized based on system gate capacity, with four primary models: A3P060, A3P125, A3P250, and A3P1000, which represent system gates from 60k to 1M. They are designed specifically to withstand extreme temperatures, functioning reliably in a range between -40°C and 125°C, making them suitable for various automotive temperature ranges (Grade 1 and Grade 2).
The devices boast high capacity and performance specifications, with system performance up to 350 MHz and various System Gates available, starting from 60k up to 1M. The FPGAs include up to 144 kbits of SRAM, and up to 300 user I/Os. The FPGAs are based on reprogrammable flash technology, incorporating 130-nm CMOS process with a 7-layer metal (copper) structure, enabling them to retain programmed design after power off.
The ProASIC3 series also emphasizes security functionalities, featuring in-system programming (ISP) protection through 128-bit Advanced Encryption Standard (AES) decryption and the FlashLock technology for preventing unauthorized access and tampering of FPGA contents. The products are geared toward ultra-low power consumption with 1.5 V core voltage, support for 1.5-V systems, and low-impedance flash switches enhancing the device’s power efficiency.
Furthermore, advanced I/O capabilities are highlighted, with support for standards like 700 Mbps DDR and LVDS, along with mixed-voltage operation, and bank-selectable I/O voltages, which improve versatility in integration. To aid in design flexibility and robust operation, the FPGAs are equipped with configurable clocks, PLLs, and I/Os that support hot-swappable and cold-sparing functionalities. In addition to the listed features, Microsemi’s datasheet showcases the robust packaging options, I/O distributions per package, and the compatibility among package types for various FPGAs within the family.
The datasheet also indicates that the ProASIC3 automotive devices adhere to important industrial standards, with all devices in production and supported by PPAP documentation, important for automotive manufacturing quality control. Information provided in Table 1 of the datasheet assures designers of the versatility and scalability within the ProASIC3 product family, highlighting the ability of the FPGAs to ensure compliance with design and board migration requirements.
The datasheet is concise yet comprehensive, aimed at engineers and designers evaluating high-performance, reprogrammable, and secure FPGAs for automotive applications, with a strong focus on reliability, flexibility, and advanced security features.
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