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The datasheet presents 3M’s IC Sockets programming solutions, including ZIP DIP sockets, Double ZIP DIP sockets, End Use ZIP DIP sockets, Shrink DIP sockets, and LCC sockets.
ZIP DIP Sockets
These sockets are designed for DIPs with 1(WV inch lead spacing and pin counts from 4 to 64. They feature a lever-actuated zero-insertion force mechanism, allowing for easy disassembly for repair.
Features
- Contact point located 1.0 inch below top surface of socket.
- Lever actuated zero-insertion force mechanism.
Double ZIP DIP Sockets
These sockets are designed for DIPs with 1(U) inch lead spacing and pin counts from 24 to 64. They feature a lever-actuated zero-insertion force mechanism, allowing for easy disassembly for repair.
End Use ZIP DIP Sockets
These sockets are designed for specific end-use applications, offering a range of pin counts and lead spacings.
Shrink DIP Sockets
These sockets are designed for DIPs with .070 inch lead spacing and 2X to 9 pins. They feature a lever-actuated zero-insertion force mechanism, allowing for easy disassembly for repair.
LCC Sockets
These sockets accept JEDEC leadless ceramic chip carriers with various optional lids.
Manual:
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Pricing & Distributors: https://www.datasheets360.com/part/detail/2-0024-03597-000-006-002/1375054217291967215/
