The data sheet provides information on 3M’s IC sockets and receptacles, including various types such as ZIP DIP, LCC, PQFP, and CQFP. The first two pages of the data sheet introduce 3M’s ZIP DIP sockets, which are designed for DIP packages with lead spacings ranging from 1.27mm to 2.54mm. These sockets can be used for programming and testing DIP devices. The data sheet also covers 3M’s LCC sockets, which accept JEDEC leadless ceramic chip carriers, and their PQFP and CQFP sockets, which provide a interface for quad flat packages. Additionally, the data sheet discusses 3M’s receptacles, including their ZIP DIP II receptacles, which provide a mounting flange for easy mounting onto printed circuit boards (PCBs). The data sheet also covers shrink DIP receptacles for compact packaging.
The data sheet also covers various packaging options, including wire-wrap (WW) and solder-tail (ST) options for the ZIP DIP and ZIP DIP II receptacles. The data sheet provides part numbers for each type of socket and receptacle, allowing for easy ordering and replacement. The data sheet also discusses features such as lead spacing, pin count, and mounting flanges for each type of socket and receptacle.
In summary, the data sheet provides detailed information on 3M’s IC sockets and receptacles, including their features, packaging options, and part numbers. This data sheet would be essential for anyone working with IC sockets and receptacles, as it provides a comprehensive overview of 3M’s product offerings in this area.
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