Pulse Toroid Polecat Series A SMT Power Inductors
Overview The Pulse Toroid Polecat Series A SMT Power Inductors are designed for high-performance applications, offering a range of inductance values from 2.0µH to 364µH. Key Features These inductors feature a low profile of 5.5mm max height, a footprint of 12.7mm x 12.7mm, and a maximum current rating of up to 8.3A. They are RoHS […]
Pulse Unshielded Drum Core PO751NLJS2NL Series SMT Power Inductors
Overview The PO751NLJS2NL series are SMT power inductors with a pulse unshielded drum core design. Key Features RoHS compliant, with a maximum height of 5.5mm and footprint of 13.0mm x 9.4mm. Current rating up to 6.8A, with an inductance range of 1.0μH to 100μH. Operating temperature range: -40°C to +130°C. Optional tape and reel packaging […]
MINIATURE SMD HCMOS OSCILLATOR F3355
Overview The F3355 is a miniature surface mount oscillator designed for high-reliability applications such as portable computers, telecommunication devices, and instrumentation. Key Features Tri-State Enable/Disable, 3000 G Shock Resistance, and hermetically sealed ceramic package. Electrical Characteristics Frequency range: 1.544 MHz to 80.000 MHz, with operating temperature range of -10°C to +70°C. Output voltage: 5.0V, with […]
FAGOR FBI1.5B5S2. FBI1.SMSS 1.5 Amp: Glass Passivated Bridge Rectifier
This datasheet describes a 1.5 A glass passivated bridge rectifier with a voltage range of 100 to 1000 V. The device features a plastic case with UL recognition 94V-0 and is ideal for printed circuit board (PCB) applications. Maximum Ratings The rectifier has a maximum RMS voltage of 70 to 700 V, a peak recurrent […]
FUJITSU SEMICONDUCTOR DATA SHEET – Resonator Piezoelectric Resonator FAR Family (C1, C3, C4 series)
The FAR Family (C1, C3, C4 series) of piezoelectric resonators features high electromechanical coupling coefficients and compact packaging. Key Features: Surface-mount technology for increased packaging density, built-in capacitors for high integration, and superior shock and vibration resistance. Series Overview: The C1 series is for high precision, while the C3 and C4 series are for exclusive […]
Microsemi ACT 2 Family FPGAs
Overview The ACT 2 family is a second-generation field-programmable gate array (FPGA) with a two-module architecture, consisting of C-modules and S-modules, optimized for combinatorial and sequential designs. Key Features Up to 8,000 gate array gates (20,000 PLD equivalent gates), replacing up to 200 TTL packages or 80 20-pin PAL packages. Features a design library with […]
Pushbutton Switch (Detachable) (Lighted/Non-Lighted) (Cylindrical 16-dia)
Overview This datasheet describes the Pushbutton Switch (Detachable) with a cylindrical 16-dia design, featuring a miniature body of 28.5 mm, the smallest in the industry. Key Features The switch unit is detachable, and the same contacts can be used for both standard loads and microloads. It has an easy-to-wire terminal arrangement and is certified for […]
ProASIC3 Flash Family FPGAs
Overview The ProASIC3 Flash Family FPGAs offer advanced features and benefits, including high-capacity flash, true dual-port SRAM, and a wide range of power supply voltage support. Key Features Up to 1 million system gates, 300 user I/Os, and 144 Kbits of true dual-port SRAM. Support for various I/O standards, including LVTTL, LVCMOS, LVPECL, LVDS, and […]
Surface Mount Fuse, 7 x 2.54 mm; Time-Lag T; 125 VAC, 125 VDC
This datasheet describes a surface mount fuse with a time-lag T characteristic, designed for use in industrial environments. Key Features Rated voltage: 125 VAC, 125 VDC Rated current: 2 – 15A Breaking capacity: 50A – 150A Approvals and Compliances Meets IEC 60127-4, UL 248-14, and CSA22.2 No. 248.14 standards Complies with CE, UKCA, RoHS, and […]
ATC 700 A Series NPO Porcelain and Ceramic Multilayer Capacitors
Overview The ATC 700 A Series offers high-performance NPO porcelain and ceramic multilayer capacitors with a capacitance range of 0.1 pF to 1000 pF. Key Features Low ESR/ESL, zero TCC, and high self-resonance make these capacitors suitable for RF and microwave applications. Rugged construction, hermetic package, and high density porcelain and ceramic materials ensure reliability […]